Title :
Effect of shield insertion on reducing crosstalk noise between coupled interconnects
Author :
Zhang, Junmou ; Friedman, Eby G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA
Abstract :
Placing shields around a victim signal line is a common way to enhance signal integrity while minimizing delay uncertainty. For two coupled interconnects with a shield between the lines, the coupling noise can produce a peak noise of 15% of Vdd in a 0.18 μm CMOS technology. A pseudo-2π RC model is used to develop an analytic estimate of the peak noise for shielded interconnects. The peak noise model is accurate within an average error of 4.4% as compared to SPICE. The effects of the shield width, length, separation between the shield and the signal, and the number of connections tieing the shield to ground on the overall crosstalk noise are described in this paper. Based on the peak noise model, a minimum number of ground connections for a target shield line with noise constraints is obtained. Inserting a shield line between two coupled interconnects is shown to be more effective in reducing crosstalk noise than increasing the physical separation.
Keywords :
CMOS integrated circuits; crosstalk; delay circuits; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; 0.18 micron; CMOS technology; SPICE; coupled interconnects; coupling noise; crosstalk noise; delay uncertainty; enhance signal integrity; peak noise model; physical separation; shield insertion effects; shielded interconnects; Capacitance; Circuit noise; Coupling circuits; Crosstalk; Equivalent circuits; Integrated circuit interconnections; Noise reduction; Switches; Switching circuits; Transfer functions;
Conference_Titel :
Circuits and Systems, 2004. ISCAS '04. Proceedings of the 2004 International Symposium on
Print_ISBN :
0-7803-8251-X
DOI :
10.1109/ISCAS.2004.1329325