DocumentCode
3369553
Title
[Front cover]
fYear
2011
fDate
2-4 May 2011
Abstract
The following topics are dealt with: I/O circuits; ESD protection; advanced transistor/material; DFM/DFT/DFR/DFY; 3D integration; CAD; advanced memory device; reliability/plasma induced damage; RF & analog; mixed signal; SoC/MPSoC/SIP; and soft error rate.
Keywords
circuit CAD; design for manufacture; design for testability; electrostatic discharge; integrated memory circuits; radiation effects; system-in-package; system-on-chip; 3D integration; CAD; ESD protection; I/O circuits; SIP; advanced material; advanced memory device; advanced transistor; design for manufacture; design for testability; design for yield; mixed signal; reliability/plasma induced damage; soft error rate; system on chip;
fLanguage
English
Publisher
ieee
Conference_Titel
IC Design & Technology (ICICDT), 2011 IEEE International Conference on
Conference_Location
Kaohsiung
ISSN
Pending
Print_ISBN
978-1-4244-9019-6
Type
conf
DOI
10.1109/ICICDT.2011.5783197
Filename
5783197
Link To Document