Title :
Special considerations for 3DIC circuit design and modeling
Author :
Liu, Sally ; Peng, Yung-Chow ; Hsueh, Fu-Lung
Author_Institution :
Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan
Abstract :
In this paper, the new elements in 3DIC are examined for enabling optimal 3D products: including 3D interconnect which maybe the limiting factor to achievable speed; 3D chip design strategy (partition and implementation) to achive optimal performance; wireless testing to address the challenges in testing a partial system / chip before stacking and with limited observation points after stacking.
Keywords :
three-dimensional integrated circuits; 3D chip design strategy; 3D interconnect; 3DIC circuit design; 3DIC circuit modeling; optimal 3D products; Couplings; Stacking; Substrates; Testing; Three dimensional displays; Through-silicon vias; Wireless communication; 3D interconnect; design strategy; wireless testing;
Conference_Titel :
IC Design & Technology (ICICDT), 2011 IEEE International Conference on
Conference_Location :
Kaohsiung
Print_ISBN :
978-1-4244-9019-6
DOI :
10.1109/ICICDT.2011.5783200
