Evolution of embedded flash memory technology for MCU

Author

Hidaka, Hideto

Author_Institution

Renesas Electron. Corp. Itami, Itami, Japan

fYear

2011

fDate

2-4 May 2011

Firstpage

1

Lastpage

4

Abstract

Embedded flash memory technology has undergone tremendous growth of demands with various performance requirements driven by expanded applications of MCU (Micro Controller Unit) products. High temperature operations with highest reliability for auto-motive applications, very low power embedded EEPROM functions for smart-cards, and ultra low-voltage operations for medical applications are driving factors in developing embedded flash technologies. Together with evolving memory cell technology, resolving performance/power trade-offs by developing dedicated design platforms with optimized eFlash technology, memory interface & bus designs, and the whole chip design methodologies, has realized advanced MCU products line-ups by split-gate MONOS flash technology with a wide range of applied products including auto-motive and security applications.

Keywords

EPROM; flash memories; microcontrollers; reliability; smart cards; system buses; 1970; MCU; automotive application; bus designs; chip design methodology; eFlash technology; embedded flash memory technology; memory cell technology; memory interface; microcontroller unit products; power trade-offs; reliability; security application; split-gate MONOS flash technology; Channel hot electron injection; EPROM; Logic gates; Nonvolatile memory; Split gate flash memory cells; charge-trapping flash memory cell; embedded flash memory; split-gate flash memory cell;

fLanguage

English

Publisher

ieee

Conference_Titel

IC Design & Technology (ICICDT), 2011 IEEE International Conference on

Conference_Location

Kaohsiung

ISSN

Pending

Print_ISBN

978-1-4244-9019-6

Type

conf

DOI

10.1109/ICICDT.2011.5783209

Filename

5783209