Title :
Soft error modeling, simulation, and testing at advanced technology nodes
Author :
Bhuva, B.L. ; Holman, W.T. ; Massengill, L.W.
Author_Institution :
Vanderbilt Univ., Nashville, TN, USA
Abstract :
As feature sizes decrease, soft errors are expected to become the dominant failure mechanisms for integrated circuits. This paper discusses the challenges that design and reliability engineers will face with the manufacture and test of ICs at advanced technology nodes.
Keywords :
integrated circuit manufacture; integrated circuit testing; radiation hardening (electronics); IC manufacture; IC test; advanced technology nodes; soft error modeling; Fabrication; Failure analysis; Integrated circuit modeling; Neutrons; Silicon; IC design; Soft errors; alpha particles; neutrons; testing;
Conference_Titel :
IC Design & Technology (ICICDT), 2011 IEEE International Conference on
Conference_Location :
Kaohsiung
Print_ISBN :
978-1-4244-9019-6
DOI :
10.1109/ICICDT.2011.5783237
