DocumentCode
3370611
Title
The SI and EMI analysis and pre-design of the sensor
Author
Han, Yajing ; Yan, Zhaowen ; Che, Mingming ; Wang, Tao
Author_Institution
EMC Lab., Beihang Univ., Beijing, China
fYear
2011
fDate
1-3 Nov. 2011
Firstpage
566
Lastpage
569
Abstract
The sensor is a multi-board system composed of backboard and other plugging boards. It is a crucial problem that how to assure the signal integrity (SI) for such a complex system. In this paper, we mainly discuss the various signal integrity plots of critical signals in digital circuit board and EMC problems in the multi-board sensor system. The SI and EMC conditions can be improved with the help of the simulations and analysis for the sensor system.
Keywords
digital circuits; electromagnetic interference; sensors; EMC problems; EMI analysis; SI analysis; backboard; digital circuit board; multiboard sensor system; multiboard system; plugging boards; signal integrity; Crosstalk; Digital circuits; Electromagnetic compatibility; Integrated circuit modeling; Printed circuits; Reflection; Silicon; EMI; SI; multi-board; sensor;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave, Antenna, Propagation, and EMC Technologies for Wireless Communications (MAPE), 2011 IEEE 4th International Symposium on
Conference_Location
Beijing
Print_ISBN
978-1-4244-8265-8
Type
conf
DOI
10.1109/MAPE.2011.6156158
Filename
6156158
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