Title :
The printed circuit board-a challenge for automated disassembly and for the design of recyclable interconnect devices
Author :
Feldmann, K. ; Scheller, H.
Author_Institution :
Inst. of Manuf. Autom. & Production Syst., Germany
Abstract :
Electronic scrap, especially the printed circuit board, is recognized as an environmental problem in Europe. Recycling practice showed that the quality of recycling of the board of today is not as good as the requirements of a sustainable product life cycle demands. To improve this state of technology several things can be done. On the one hand, the recycling processes have to be improved; here automated disassembly can be a partial solution. In addition new technologies for the `green´ interconnect device have be investigated and a Design for Recycling tool has to be implemented and introduced into industrial product development. This paper will show some attempts at realization
Keywords :
cost-benefit analysis; identification; industrial robots; joining processes; printed circuit design; printed circuit manufacture; product development; recycling; SCARA robot; automated disassembly; design for recycling tool; electronic scrap; evacuate and sort; green interconnect device; identification; industrial product development; joining techniques; look and pick; printed circuit board; recyclable interconnect device design; sorting; sustainable product life cycle;
Conference_Titel :
Clean Electronics Products and Technology, 1995. (CONCEPT), International Conference on
Conference_Location :
Edinburgh
Print_ISBN :
0-85296-651-2
DOI :
10.1049/cp:19951182
