Title :
Achievements and Perspectives of the Drie Technology for the Microsystems Market
Author :
Puech, M. ; Thevenoud, J.M. ; Gruffat, J.M. ; Launay, N. ; Godinat, P. ; Le Barillec, O.
Author_Institution :
Alcatel Micro Machining Syst., Annecy
Abstract :
This paper presents the evolution of the DRIE of silicon over the last decade. Starting with the initial MEMS product requirements, the DRIE demonstrated its potential to improve the delivered performances in line with the evolution of the Microsystems requirements. In less than a decade, the DRIE etching rate and aspect ratio have been multiplied by an impressive factor of 10. This outstanding capabilities favored its adoption in new microelectronic applications which lead to a step forward in the development of an extended range of tools and processes. As a result, the Microsystems will benefit from those latest developments.
Keywords :
micromachining; micromechanical devices; sputter etching; DRIE technology; MEMS product requirements; deep reactive ion etching; etching rate; micromachining; microsystems market; Anisotropic magnetoresistance; Capacitors; Etching; Micromechanical devices; Plasma applications; Plasma chemistry; Plasma density; Plasma sources; Polymer films; Silicon; DRIE; ICP source; MEMS; Microsystems; etching rate; glass; silicon;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
DOI :
10.1109/SENSOR.2007.4300075
