• DocumentCode
    33718
  • Title

    An Analytical Model With 2-D Effects for 4H-SiC Trenched Junction Barrier Schottky Diodes

  • Author

    Na Ren ; Kuang Sheng

  • Author_Institution
    Dept. of Electr. Eng., Zhejiang Univ., Hangzhou, China
  • Volume
    61
  • Issue
    12
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    4158
  • Lastpage
    4165
  • Abstract
    This paper presents an analytical model with 2-D effects for 1200 V 4H-silicon carbide trenched junction barrier Schottky (TJBS) diodes. Energy band diagrams of junction barrier Schottky and TJBS diodes in reverse biases are analyzed in detail. An analytical model of potential and electric field distributions with 2-D effects is proposed. Based on the modeling results of the surface electric field, a physical model accounting for three main mechanisms, namely, thermionic emission, tunneling, and avalanche multiplication is developed for the device reverse I-V characteristics. The models are verified by experimental results. Based on the physical model, optimization of the TJBS parameters including barrier height, junction depth, and junction spacing can be carried out with the target of achieving the lowest device ON-state voltage while limiting the reverse leakage current to a reasonable level. As a result, for a given breakdown voltage, an optimum set of parameters can be obtained.
  • Keywords
    Schottky diodes; electric breakdown; optimisation; semiconductor device models; silicon compounds; wide band gap semiconductors; 2D effects; SiC; avalanche multiplication; barrier height; breakdown voltage; electric field distributions; energy band diagrams; junction depth; junction spacing; potential field distributions; reverse biases; reverse leakage current; surface electric field; thermionic emission; trenched junction barrier Schottky diodes; tunneling; Analytical models; Electric potential; Junctions; Leakage currents; Schottky diodes; Tunneling; 4H-silicon carbide (SiC); junction barrier Schottky (JBS); trenched JBS (TJBS); trenched JBS (TJBS).;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2014.2365519
  • Filename
    6951342