DocumentCode
3372126
Title
A quantitative analysis of stress induced excess current (SIEC) in SiO/sub 2/ films
Author
Sakakibara, Kiyohiko ; Ajika, Natsuo ; Hatanaka, Masahiro ; Miyoshi, Hirokazu
Author_Institution
ULSI Lab., Mitsubishi Electr. Corp., Itami, Japan
fYear
1996
fDate
April 30 1996-May 2 1996
Firstpage
100
Lastpage
107
Abstract
The low-level stress induced excess current (SIEC) characteristics of 92 /spl Aring/ wet oxide are investigated in detail. As a result of the systematic investigations of the low-level E-J characteristics and the corresponding changes of net oxide charge, we have found that SIEC can be interpreted as electron tunneling processes into five kinds of different traps. As for the reproducible SIEC components, a quantitative analysis has been developed. By precisely modeling the trap assisted tunneling process, it has been shown that the E-J and t-J characteristics of the pretunneling region can be completely simulated as an electron tunneling process into the neutral trap. Using this analysis, it has been found that the local neutral trap density in bulk SiO/sub 2/ remains constant under the same hole fluence Qhole, regardless of the electric field strength during V/sub g/>0 FN stresses. In consequence, it has been concluded that the neutral trap has been created by holes injected into the oxide during the stresses.
Keywords
MOS integrated circuits; ULSI; electron traps; hot carriers; insulating thin films; integrated circuit reliability; integrated circuit testing; silicon compounds; tunnelling; 92 angstrom; MOS ICs; SiO/sub 2/; ULSI; electric field strength; electron tunneling processes; local neutral trap density; low-level E-J characteristics; stress induced excess current; trap assisted tunneling process; wet oxide; Channel bank filters; Charge measurement; Current measurement; Electric variables measurement; Electrical resistance measurement; IEL; Performance evaluation; Stress measurement; Tunneling; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1996. 34th Annual Proceedings., IEEE International
Conference_Location
Dallas, TX, USA
Print_ISBN
0-7803-2753-5
Type
conf
DOI
10.1109/RELPHY.1996.492067
Filename
492067
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