DocumentCode :
3372126
Title :
A quantitative analysis of stress induced excess current (SIEC) in SiO/sub 2/ films
Author :
Sakakibara, Kiyohiko ; Ajika, Natsuo ; Hatanaka, Masahiro ; Miyoshi, Hirokazu
Author_Institution :
ULSI Lab., Mitsubishi Electr. Corp., Itami, Japan
fYear :
1996
fDate :
April 30 1996-May 2 1996
Firstpage :
100
Lastpage :
107
Abstract :
The low-level stress induced excess current (SIEC) characteristics of 92 /spl Aring/ wet oxide are investigated in detail. As a result of the systematic investigations of the low-level E-J characteristics and the corresponding changes of net oxide charge, we have found that SIEC can be interpreted as electron tunneling processes into five kinds of different traps. As for the reproducible SIEC components, a quantitative analysis has been developed. By precisely modeling the trap assisted tunneling process, it has been shown that the E-J and t-J characteristics of the pretunneling region can be completely simulated as an electron tunneling process into the neutral trap. Using this analysis, it has been found that the local neutral trap density in bulk SiO/sub 2/ remains constant under the same hole fluence Qhole, regardless of the electric field strength during V/sub g/>0 FN stresses. In consequence, it has been concluded that the neutral trap has been created by holes injected into the oxide during the stresses.
Keywords :
MOS integrated circuits; ULSI; electron traps; hot carriers; insulating thin films; integrated circuit reliability; integrated circuit testing; silicon compounds; tunnelling; 92 angstrom; MOS ICs; SiO/sub 2/; ULSI; electric field strength; electron tunneling processes; local neutral trap density; low-level E-J characteristics; stress induced excess current; trap assisted tunneling process; wet oxide; Channel bank filters; Charge measurement; Current measurement; Electric variables measurement; Electrical resistance measurement; IEL; Performance evaluation; Stress measurement; Tunneling; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1996. 34th Annual Proceedings., IEEE International
Conference_Location :
Dallas, TX, USA
Print_ISBN :
0-7803-2753-5
Type :
conf
DOI :
10.1109/RELPHY.1996.492067
Filename :
492067
Link To Document :
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