• DocumentCode
    3372249
  • Title

    Micromachined Bulk Wave Acoustic Bandgap Devices

  • Author

    Olsson, Roy H., III ; Fleming, James G. ; El-Kady, Ihab F. ; Tuck, Melanie R. ; McCormick, Frederick B.

  • Author_Institution
    Sandia Nat. Lab., Albuquerque
  • fYear
    2007
  • fDate
    10-14 June 2007
  • Firstpage
    317
  • Lastpage
    321
  • Abstract
    A MEMS bulk wave acoustic bandgap has been designed and experimentally verified. The acoustic bandgaps are realized by including tungsten (W) scatterers in a SiO2 matrix. Wide frequency ranges where acoustic waves are forbidden to exist are formed due to the large density and acoustic impedance mismatch between W and SiO2. The acoustic bandgap structures are fabricated in a 7-mask process that features integrated aluminum nitride piezoelectric couplers. Acoustic bandgaps in a square lattice have been measured at 33 and 67 MHz with up to 35 dB of acoustic rejection and bandwidths exceeding 35% of the midgap.
  • Keywords
    bulk acoustic wave devices; micromechanical devices; piezoelectric devices; 7-mask process; MEMS bulk wave acoustic bandgap device; aluminum nitride piezoelectric coupler; fabrication technology; Acoustic devices; Acoustic scattering; Acoustic waves; Aluminum nitride; Couplers; Frequency; Impedance; Micromechanical devices; Photonic band gap; Tungsten; acoustic bandgap; acoustic crystal; aluminum nitride; phononic bandgap; phononic crystal;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
  • Conference_Location
    Lyon
  • Print_ISBN
    1-4244-0842-3
  • Electronic_ISBN
    1-4244-0842-3
  • Type

    conf

  • DOI
    10.1109/SENSOR.2007.4300132
  • Filename
    4300132