DocumentCode :
3372325
Title :
The Influence of surface Profile on Leakage in Roomtemperature Seal-Bonding
Author :
Okada, H. ; Itoh, T. ; Suga, T.
Author_Institution :
Univ. of Tokyo, Tokyo
fYear :
2007
fDate :
10-14 June 2007
Firstpage :
339
Lastpage :
342
Abstract :
We have developed a new calculation method of sealing quality at a bonding interface based on measured data of surface profiles and investigated influence of the surface profiles on leakage in room temperature vacuum seal-bonding. Leak rates decreased slowly as contact ratio increased, before they decreased drastically at a contact ratio close to Pc at which leak paths disappear at a bonding interface. When a contact ratio is lower than the one at which the leak rates decreased markedly, the leak rate is at least 10-13 Pa m3/sec which is insufficient to keep inside cavity pressure vacuum for a long time. These results show that vacuum sealing needs the contact ratio which is higher than Pc.
Keywords :
bonding processes; seals (stoppers); surface treatment; cavity pressure vacuum; contact ratio; leak rates; room temperature seal-bonding; surface profile; vacuum seal-bonding; vacuum sealing; Atomic measurements; Chemicals; Gaskets; Gold; Lattices; Micromechanical devices; Rough surfaces; Surface roughness; Temperature; Wafer bonding; Leakage; MEMS; Surface Activated bonding (SAB); Vacuum sealing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
Type :
conf
DOI :
10.1109/SENSOR.2007.4300137
Filename :
4300137
Link To Document :
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