DocumentCode :
3372518
Title :
Capacitor dendrite failure analysis for lidless CPU testing
Author :
Weidong, Huang ; Changhong, Yu ; Cimi, Cui ; Zuo, Deshan ; Hongwei, Guo ; Xie, Chao ; Majed, Anani
Author_Institution :
AMD Technol. (China) Co., Ltd., Suzhou, China
fYear :
2012
fDate :
2-6 July 2012
Firstpage :
1
Lastpage :
4
Abstract :
One lidless CPU product failed more than 20% of visual inspections due to foreign material near the capacitor electrodes during testing production. This paper presents the analysis method for the foreign material, formation mechanism of dendrites, verification experiment by DOE, root cause for this case, and corrective solutions.
Keywords :
capacitors; dendrites; design of experiments; electrodes; electron device testing; electronics packaging; failure analysis; DOE; capacitor dendrite failure analysis; capacitor electrodes; design of experiment; foreign material; lidless package CPU testing; testing production; visual inspections; Capacitors; Central Processing Unit; Electrodes; Humidity; Materials; Production; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Conference_Location :
Singapore
ISSN :
1946-1542
Print_ISBN :
978-1-4673-0980-6
Type :
conf
DOI :
10.1109/IPFA.2012.6306253
Filename :
6306253
Link To Document :
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