DocumentCode
337259
Title
A microchip electrochemical immunosensor fabricated using micromachining techniques
Author
Choi, Jin-Woo ; Ding, Ying ; Ahn, Chong H. ; Halsall, H. Brian ; Heineman, William R.
Author_Institution
Center for Microelectron. Sensors & MEMS, Cincinnati Univ., OH, USA
Volume
5
fYear
1997
fDate
1997
Firstpage
2264
Abstract
Using micromachining techniques, an electrochemical immunosensor has been designed, fabricated and tested on a Pyrex glass wafer. The sensor has an electrochemical cell that is composed of a reference, an auxiliary and two working electrodes on a spin-coated polyimide film, where the reference electrode is silver and the others are platinum. The polyimide film is used for antibody immobilization instead of a polystyrene sheet which is usually used in conventional immunosensors. A reaction chamber is fabricated separately on a silicon wafer using anisotropic etching techniques. The electrochemical cell on a glass wafer and the reaction chamber on a silicon wafer are then bonded together to construct the immunosensor using polymer bonding techniques. Fabricated immunosensors are tested by the method of cyclic voltammetry (CV) before analyzing the antigen-antibody reaction. Test antibodies are well attached to the polyimide substrate, and the results of the CV test shows that this immunosensor can be successfully applied for electrochemical immunoassay
Keywords
biosensors; electrochemical sensors; etching; intelligent sensors; microfluidics; micromachining; microsensors; voltammetry (chemical analysis); Pyrex glass wafer; Si; anisotropic etching; antibody immobilization; antigen-antibody reaction; cyclic voltammetry; electrochemical cell; microchip electrochemical immunosensor; microfluidic system; micromachining; reaction chamber; silicon wafer; smart immunosensor; spin-coated polyimide film; Anisotropic magnetoresistance; Electrodes; Glass; Micromachining; Platinum; Polyimides; Silicon; Silver; Testing; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE
Conference_Location
Chicago, IL
ISSN
1094-687X
Print_ISBN
0-7803-4262-3
Type
conf
DOI
10.1109/IEMBS.1997.758812
Filename
758812
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