• DocumentCode
    337259
  • Title

    A microchip electrochemical immunosensor fabricated using micromachining techniques

  • Author

    Choi, Jin-Woo ; Ding, Ying ; Ahn, Chong H. ; Halsall, H. Brian ; Heineman, William R.

  • Author_Institution
    Center for Microelectron. Sensors & MEMS, Cincinnati Univ., OH, USA
  • Volume
    5
  • fYear
    1997
  • fDate
    1997
  • Firstpage
    2264
  • Abstract
    Using micromachining techniques, an electrochemical immunosensor has been designed, fabricated and tested on a Pyrex glass wafer. The sensor has an electrochemical cell that is composed of a reference, an auxiliary and two working electrodes on a spin-coated polyimide film, where the reference electrode is silver and the others are platinum. The polyimide film is used for antibody immobilization instead of a polystyrene sheet which is usually used in conventional immunosensors. A reaction chamber is fabricated separately on a silicon wafer using anisotropic etching techniques. The electrochemical cell on a glass wafer and the reaction chamber on a silicon wafer are then bonded together to construct the immunosensor using polymer bonding techniques. Fabricated immunosensors are tested by the method of cyclic voltammetry (CV) before analyzing the antigen-antibody reaction. Test antibodies are well attached to the polyimide substrate, and the results of the CV test shows that this immunosensor can be successfully applied for electrochemical immunoassay
  • Keywords
    biosensors; electrochemical sensors; etching; intelligent sensors; microfluidics; micromachining; microsensors; voltammetry (chemical analysis); Pyrex glass wafer; Si; anisotropic etching; antibody immobilization; antigen-antibody reaction; cyclic voltammetry; electrochemical cell; microchip electrochemical immunosensor; microfluidic system; micromachining; reaction chamber; silicon wafer; smart immunosensor; spin-coated polyimide film; Anisotropic magnetoresistance; Electrodes; Glass; Micromachining; Platinum; Polyimides; Silicon; Silver; Testing; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-4262-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.1997.758812
  • Filename
    758812