DocumentCode
3372653
Title
Process-Independent, Ultrasound-Enhanced, Electrostatic Batch Assembly
Author
Ardanuç, Serhan ; Lal, Amit ; Reyes, David
Author_Institution
Cornell Univ., Ithaca
fYear
2007
fDate
10-14 June 2007
Firstpage
407
Lastpage
410
Abstract
This paper describes a batch assembly method for 3D microsystems that is based on combining electrostatic forces and ultrasonic actuation. Simplicity of the setup, applicability to a broad range of surface micromachining processes, and the lack of any additional fabrication steps or exotic materials are the foremost advantages of this method. These attributes distinguish it from other popular assembly methods that rely on surface tension, magnetic coatings, robotics, etc.
Keywords
electrostatics; microassembling; micromachining; 3D microsystem; electrostatic batch assembly; magnetic coatings; surface micromachining; surface tension; ultrasonic actuation; Actuators; Assembly systems; Electrodes; Electrostatics; Micromechanical devices; Robotic assembly; Surface tension; Switches; Ultrasonic imaging; Voltage; MEMS assembly; electrostatic assembly; optical MEMS; ultrasonic assembly;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location
Lyon
Print_ISBN
1-4244-0842-3
Electronic_ISBN
1-4244-0842-3
Type
conf
DOI
10.1109/SENSOR.2007.4300154
Filename
4300154
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