DocumentCode
3372666
Title
Failure analysis on multilayer ceramic capacitor (MLCC) with leakage failure caused by silver (Ag) migration in molded plastic package
Author
Ng, K.K. ; Rajaratnam, M.
Author_Institution
Infineon Technol. (Malaysia) Sdn Bhd, Batu Berendam, Malaysia
fYear
2012
fDate
2-6 July 2012
Firstpage
1
Lastpage
6
Abstract
Various analysis techniques inclusive cross section, parallel grinding, package decapsulation, SEM and EDX had been performed to determine the cause of high leakage on MLCC samples. At the end, analysis method combining the mechanical cracking and laser ablation was successfully pin point the failure was due to Ag migration at the external package of MLCC.
Keywords
ceramic capacitors; cracks; electronics packaging; failure analysis; laser ablation; plastic packaging; EDX; SEM; failure analysis; inclusive cross section; laser ablation; leakage failure; mechanical cracking; molded plastic package; multilayer ceramic capacitor; package decapsulation; parallel grinding; silver migration; Capacitors; Ceramics; Chemicals; Compounds; Lapping; Performance evaluation; Silver;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Conference_Location
Singapore
ISSN
1946-1542
Print_ISBN
978-1-4673-0980-6
Type
conf
DOI
10.1109/IPFA.2012.6306260
Filename
6306260
Link To Document