DocumentCode :
3372670
Title :
Micro-Scale System Integration Via Molten-Alloy Driven Self-Assembly and Scaling of Metal Interconnects
Author :
Morris, Christopher J. ; Parviz, Babak A.
Author_Institution :
Univ. of Washington, Seattle
fYear :
2007
fDate :
10-14 June 2007
Firstpage :
411
Lastpage :
414
Abstract :
Self-assembly, or the spontaneous organization of parts into larger structures via energy minimization, is an attractive solution to overcome packaging and integration challenges. Capillary forces from a molten alloy constitute one self-assembly method, but little is known about reducing molten alloy contact size while maintaining proper function. We address these issues using a eutectic Bi-Sn alloy, and overcome corrosion problems by selecting the right fluid environment. We demonstrate the self-assembly of 100 mum and 40 mum sized parts on templates, with yields of 97% and 85%, respectively. Yields were lower with 20 mum parts, suggesting a lower limit for this particular system.
Keywords :
bismuth alloys; corrosion; eutectic alloys; integrated circuit interconnections; integrated circuit packaging; integrated circuit yield; liquid metals; self-assembly; solders; tin alloys; Bi-Sn; capillary forces; corrosion problems; eutectic solder alloy; fluid environment; metal interconnects scaling; microscale system integration; molten-alloy driven self-assembly method; size 100 mum; size 40 mum; system yield; Corrosion; Electronics packaging; Etching; Microelectromechanical systems; Micromechanical devices; Nonhomogeneous media; Oxidation; Self-assembly; Silicon alloys; Testing; capillary forces; eutectic Bi-Sn solder; packaging; self-assembly;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
Type :
conf
DOI :
10.1109/SENSOR.2007.4300155
Filename :
4300155
Link To Document :
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