DocumentCode :
3372970
Title :
MEMS Process Flow Insensitive to Timed ETCH Induced Anchor Perimeter Variation on SOI and Bulk Silicon Wafer Substrates
Author :
Brien, G. J O ; Monk, D.J.
Author_Institution :
Arizona State Univ., Tempe
fYear :
2007
fDate :
10-14 June 2007
Firstpage :
481
Lastpage :
484
Abstract :
This paper describes a novel silicon on insulator (SOI) process flow with an electrically isolated mechanical substrate anchor perimeter insensitive to SiO2 sacrificial layer timed hydrofluoric acid etch variation. A novel low electrical resistance substrate connection is facilitated between the top SOI layer and silicon substrate using a polysilicon trench refill via process step. A process combining both the silicon nitride substrate anchor perimeter etch stop and polysilicon substrate electrical contact is provided with device characterization results. Additionally, this trench refill process is applied to bulk micromachined devices by utilizing SiO2 and heavily boron doped polysilicon as the trench refilled EDP/TMAH etch stop films. A capacitive accelerometer suspended over 80 mum above the silicon wafer substrate is also demonstrated using this process technique.
Keywords :
electric resistance; hydrogen compounds; micromechanical devices; silicon-on-insulator; substrates; B:Si; HF; MEMS process flow; SOI; SiO2; anchor perimeter variation; bulk silicon wafer substrates; capacitive accelerometer; hydrofluoric acid; low electrical resistance; mechanical substrate; micromachined devices; polysilicon trench refill; silicon on insulator; Accelerometers; Contacts; Costs; Dielectrics and electrical insulation; Electric resistance; Etching; Hafnium; Micromechanical devices; Silicon on insulator technology; Substrates; Bulk Silicon; Etch-Stop; Silicon on Insulator; Substrate Contact;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
Type :
conf
DOI :
10.1109/SENSOR.2007.4300172
Filename :
4300172
Link To Document :
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