Wet Release of Multipolymeric Structures with a Nanoscale Release Layer

A promising wet release process using OmniCoat^TM has been developed for the release of the multilayer microsensor device that is being used for biomedical applications. OmniCoat^TM has high thermal stability (Tg ~190degC) which makes it compatible with high temperature processes. A multilayer fabrication approach and OmniCoat release layer was successfully integrated for a microsensor device to be released from the substrate. Highly aligned structures and good adhesion between metals and cured polymer layers have been achieved. OmniCoat^TM as a release layer has great potential in several other MEMS applications where SU-8 is used as a structural material.