A High Aspect Ratio, Flexible, Transparent and Low-Cost Parylene-C Shadow Mask Technology for Micropatterning Applications

Author

Selvarasah, S. ; Chao, S.H. ; Chen, C.-L. ; Mao, D. ; Hopwood, J. ; Ryley, S. ; Sridhar, S. ; Khademhosseini, A. ; Busnaina, A. ; Dokmeci, M.R.

Author_Institution

Northeastern Univ., Boston

fYear

2007

fDate

10-14 June 2007

Firstpage

533

Lastpage

536

Abstract

In this paper, we present a flexible parylene-C shadow mask technology for creating microscale patterns on flat and curved surfaces. The smallest feature size of 4 mum is demonstrated and the technology is scalable up to full wafer size. With the addition of SU-8 pillars, we also demonstrate multi mask processing with an alignment accuracy of about 5-6 mum. To achieve the smallest features, a low temperature and high aspect ratio (>8:1) parylene etch process is also developed. Utilizing this shadow mask, we successfully patterned proteins and cells on various surfaces (glass, PDMS, methacrylate) up to 9 times. This technology has potential applications for patterning proteins, cells and organic transistors on conventional and/or unconventional substrates.

Keywords

bioMEMS; cellular biophysics; etching; masks; micromechanical devices; organic semiconductors; proteins; transistors; alignment accuracy; high aspect ratio parylene etch process; low-cost parylene-C shadow mask technology; micropatterning applications; multimask processing; organic transistors; patterned cells; patterned proteins; size 4 mum; Adhesives; Glass; Large-scale systems; Plasma applications; Plasma temperature; Polymers; Proteins; Silicon; Sputter etching; Surface topography; Flexible Shadow masks; High Aspect Ratio Polymer Etching; Parylene-C;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International

Conference_Location

Lyon

Print_ISBN

1-4244-0842-3

Electronic_ISBN

1-4244-0842-3

Type

conf

DOI

10.1109/SENSOR.2007.4300185

Filename

4300185