Title :
Case studies on application of Time Resolved Imaging Emission Microscopy for backside timing analysis
Author :
Uchikado, A. ; Kawanab, S. ; Okubo, Takanori ; Shimase, A. ; Majima, T. ; Hirai, Naoshi ; Ito, Yu ; Nakamura, T.
Author_Institution :
Product Failure Anal. Dept., Renesas Electron. Corp., Kodaira, Japan
Abstract :
We studied a backside timing analysis technique utilizing Time Resolved Imaging Emission Microscopy (TRIEM) which can acquire emission data locations and timing simultaneously from an activated LSI chip. In this paper, we will present two case studies of actual failed chips. One is a delay fault case, and the other is a current fault case. Then, we will propose an analysis flow applying TRIEM based on the experimental results.
Keywords :
integrated circuit testing; large scale integration; timing; activated LSI chip; analysis flow; backside timing analysis; delay fault case; failed chip; time resolved imaging emission microscopy; Circuit faults; Clocks; Delay; Logic gates; Microscopy; Photonics;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-0980-6
DOI :
10.1109/IPFA.2012.6306291
