• DocumentCode
    3373269
  • Title

    Case studies on application of Time Resolved Imaging Emission Microscopy for backside timing analysis

  • Author

    Uchikado, A. ; Kawanab, S. ; Okubo, Takanori ; Shimase, A. ; Majima, T. ; Hirai, Naoshi ; Ito, Yu ; Nakamura, T.

  • Author_Institution
    Product Failure Anal. Dept., Renesas Electron. Corp., Kodaira, Japan
  • fYear
    2012
  • fDate
    2-6 July 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We studied a backside timing analysis technique utilizing Time Resolved Imaging Emission Microscopy (TRIEM) which can acquire emission data locations and timing simultaneously from an activated LSI chip. In this paper, we will present two case studies of actual failed chips. One is a delay fault case, and the other is a current fault case. Then, we will propose an analysis flow applying TRIEM based on the experimental results.
  • Keywords
    integrated circuit testing; large scale integration; timing; activated LSI chip; analysis flow; backside timing analysis; delay fault case; failed chip; time resolved imaging emission microscopy; Circuit faults; Clocks; Delay; Logic gates; Microscopy; Photonics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
  • Conference_Location
    Singapore
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4673-0980-6
  • Type

    conf

  • DOI
    10.1109/IPFA.2012.6306291
  • Filename
    6306291
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3373269