Title :
Mechanical Properties of Electrodeposited Permalloy Thin Film Measured by using a Tensile Test
Author :
Li, Xueping ; Ding, Guifu ; Wang, Hong ; Ando, Taeko ; Shikida, Mitsuhiro ; Sato, Kazuo
Author_Institution :
Shanghai Jiao Tong Univ., Shanghai
Abstract :
In order to improve the reliability of Micro-electro-mechanical Systems (MEMS) designs, evaluations of the mechanical properties of soft magnetic materials are needed. In this paper, we present a tensile testing method to characterize the mechanical properties of microscale electroplated permalloy (80 wt% Ni, 20 wt% Fe) films. The gauge section of the specimen is 50 mum wide, 100 long and 5 mum thick. The measured Young´s modulus of permalloy films is 113 GPa, and the tensile strength is 1.57 GPa. Both the properties are lower than those of thick permalloy films. The fracture strain measured by the images of specimens is about 2%.
Keywords :
electrodeposition; micromechanical devices; tensile testing; thin films; MEMS; Young´s modulus; electrodeposited permalloy thin films; gauge section; mechanical property; microelectro-mechanical systems; soft magnetic materials; tensile strength; tensile test; Iron; Materials reliability; Mechanical factors; Mechanical variables measurement; Microelectromechanical systems; Micromechanical devices; Soft magnetic materials; Strain measurement; Testing; Transistors; Mechanical Properties; Permalloy; Tensile Test; Thin Film;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
DOI :
10.1109/SENSOR.2007.4300190
