• DocumentCode
    3373446
  • Title

    Gate oxide thickness dependence of RIE-induced damages on n-channel MOSFET reliability

  • Author

    Joshi, A.B. ; Chung, L. ; Min, B.W. ; Kwong, D.L.

  • Author_Institution
    Rockwell Semicond. Syst., Newport Beach, CA, USA
  • fYear
    1996
  • fDate
    April 30 1996-May 2 1996
  • Firstpage
    300
  • Lastpage
    304
  • Abstract
    We have investigated the effect of gate oxide thickness scaling on RIE-induced damage in n-MOSFETs. Our results show that active damage to gate oxide increases as the thickness is scaled down. On the other hand, thinner gate oxide devices show smaller degradation under hot carrier as well as Fowler-Nordheim stress compared to thicker gate oxide devices for a given antenna type and ratio. Reduced degradation in thinner oxide MOSFETs is explained based on smaller mobility degradation as well as on higher amount of channel inversion charge.
  • Keywords
    MOSFET; carrier mobility; dielectric thin films; hot carriers; semiconductor device reliability; sputter etching; Fowler-Nordheim stress; NMOSFET reliability; RIE-induced damage; channel inversion charge; gate oxide thickness dependence; hot carrier stress; mobility degradation; n-channel MOSFET; oxide thickness scaling; Degradation; Hot carriers; MOSFET circuits; Plasma devices; Plasma materials processing; Plasma properties; Plasma sources; Semiconductor device reliability; Silicon; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1996. 34th Annual Proceedings., IEEE International
  • Conference_Location
    Dallas, TX, USA
  • Print_ISBN
    0-7803-2753-5
  • Type

    conf

  • DOI
    10.1109/RELPHY.1996.492134
  • Filename
    492134