DocumentCode
3373446
Title
Gate oxide thickness dependence of RIE-induced damages on n-channel MOSFET reliability
Author
Joshi, A.B. ; Chung, L. ; Min, B.W. ; Kwong, D.L.
Author_Institution
Rockwell Semicond. Syst., Newport Beach, CA, USA
fYear
1996
fDate
April 30 1996-May 2 1996
Firstpage
300
Lastpage
304
Abstract
We have investigated the effect of gate oxide thickness scaling on RIE-induced damage in n-MOSFETs. Our results show that active damage to gate oxide increases as the thickness is scaled down. On the other hand, thinner gate oxide devices show smaller degradation under hot carrier as well as Fowler-Nordheim stress compared to thicker gate oxide devices for a given antenna type and ratio. Reduced degradation in thinner oxide MOSFETs is explained based on smaller mobility degradation as well as on higher amount of channel inversion charge.
Keywords
MOSFET; carrier mobility; dielectric thin films; hot carriers; semiconductor device reliability; sputter etching; Fowler-Nordheim stress; NMOSFET reliability; RIE-induced damage; channel inversion charge; gate oxide thickness dependence; hot carrier stress; mobility degradation; n-channel MOSFET; oxide thickness scaling; Degradation; Hot carriers; MOSFET circuits; Plasma devices; Plasma materials processing; Plasma properties; Plasma sources; Semiconductor device reliability; Silicon; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1996. 34th Annual Proceedings., IEEE International
Conference_Location
Dallas, TX, USA
Print_ISBN
0-7803-2753-5
Type
conf
DOI
10.1109/RELPHY.1996.492134
Filename
492134
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