DocumentCode
3373567
Title
Failure Analysis of Sub-Micrometer Devices and Structures Using Scanning Thermal Microscopy
Author
Majumdar, A. ; Luo, K. ; Lai, J. ; Shi, Z.
fYear
1996
fDate
April 30 1996-May 2 1996
Firstpage
342
Keywords
Atomic beams; Atomic force microscopy; Electrostatic discharge; Failure analysis; Image resolution; Liquid crystals; Power dissipation; Spatial resolution; Temperature; Thermal engineering;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1996. 34th Annual Proceedings., IEEE International
Conference_Location
Dallas, TX, USA
Print_ISBN
0-7803-2753-5
Type
conf
DOI
10.1109/RELPHY.1996.492140
Filename
492140
Link To Document