• DocumentCode
    3373781
  • Title

    Modeling and Measurement of the Dynamic Performance of an OHMIC Contact-Type RF MEMS Switch

  • Author

    Guo, Z.J. ; McGruer, N.E. ; Adams, G.G.

  • Author_Institution
    Northeastern Univ., Boston
  • fYear
    2007
  • fDate
    10-14 June 2007
  • Firstpage
    651
  • Lastpage
    654
  • Abstract
    A dynamic model has been developed to investigate the transient mechanical response of an ohmic contact-type RF MEMS switch. The model combines the built-in characteristics of a commercial finite element package and a finite difference method. The model includes a realistic geometry, the electrostatic actuation, two-dimensional squeeze-film damping, slip-flow terms due to molecular effects, the nonlinear elastic contact, and the JKR adhesive force. The time-dependent characteristics of the microswitch, which include switching speed, electrostatic force, squeeze-film damping force, slip-flow, impact force, and contact tip bounce have been simulated using this model. Contact tip bounce is observed for a single-step actuation voltage whereas a properly tailored dual-actuation pulse can be used to eliminate bounce while maintaining a fast closing time. The slip-flow of the gas film between the two sides of the electrostatic actuator results in a larger correction at low actuation voltages than at high actuation voltages. The simulated results are in good agreement with experimental measurements of the microswitch.
  • Keywords
    damping; finite difference methods; microswitches; ohmic contacts; transient response; 2D squeeze-film damping; JKR adhesive force; RF MEMS switch; contact tip bounce; dynamic performance; electrostatic actuation; finite difference method; nonlinear elastic contact; ohmic contacts; realistic geometry; slip-flow; transient mechanical response; Contacts; Damping; Electrostatic actuators; Finite difference methods; Finite element methods; Microswitches; Packaging; Radiofrequency microelectromechanical systems; Switches; Voltage; RF MEMS switch; adhesion; nonlinear contact; slip-flow; squeeze-film damping;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
  • Conference_Location
    Lyon
  • Print_ISBN
    1-4244-0842-3
  • Electronic_ISBN
    1-4244-0842-3
  • Type

    conf

  • DOI
    10.1109/SENSOR.2007.4300214
  • Filename
    4300214