DocumentCode :
3373875
Title :
Design and Fabrication of a Laterally Driven Bistable Electromagnetic Microrelay
Author :
Hwang, S.J. ; Lee, M.G. ; Jung, P.G. ; Kim, J.H. ; Oh, D.J. ; Go, J.S. ; Shin, B. ; Ko, J.S.
Author_Institution :
Pusan Nat. Univ., Pusan
fYear :
2007
fDate :
10-14 June 2007
Firstpage :
671
Lastpage :
674
Abstract :
A laterally driven bistable electromagnetic microrelay has been designed, fabricated, and tested. The working principle of the proposed microrelay is based on the Fleming´s left hand rule. Silicon-on-insulator wafers are used for electrical isolation and releasing of the moving microstructures. The high-aspect-ratio microstructures are fabricated using a DRIE process. The tandem-typed arch- shaped leaf springs with a silicon/gold composite layer enhance the mechanical performances while reducing the electrical resistance. A permanent magnet is attached at the bottom of the silicon substrate, resulting in the generation of an external magnetic field in the vertical direction of the silicon substrate. The leaf springs show a bistable behavior. The resistance of the pair of leaf springs was 5.5Omega and the contact resistance was 4.7Omega. The driving voltage is measured to be plusmn0.5 V.
Keywords :
electromagnetic devices; microrelays; permanent magnets; silicon-on-insulator; sputter etching; substrates; DRIE process; electrical isolation; electrical resistance; high-aspect-ratio microstructures; laterally driven bistable electromagnetic microrelay; permanent magnet; silicon substrate; silicon-on-insulator wafers; tandem-typed arch- shaped leaf springs; Contact resistance; Electric resistance; Fabrication; Gold; Magnetic field measurement; Microrelays; Microstructure; Silicon on insulator technology; Springs; Testing; Lorenz force; bistable; electromagnetic; microrelay;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
Type :
conf
DOI :
10.1109/SENSOR.2007.4300219
Filename :
4300219
Link To Document :
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