Title :
Developing functional Prototypes by package modification using plasma FIB technology
Author :
Gonzales, Michael ; Cruz, Roddy ; Parley, Martin ; Lau, Jonathan ; DiBattista, Michael ; Routh, Bryan, Jr. ; Landin, Trevan ; Carleson, Peter ; Huggins, Ebb ; Mani, Kenny
Author_Institution :
Qualcomm Inc., San Diego, CA, USA
Abstract :
Packaging technology plays a key role in the performance of many analog and RF circuits. Due to the size and geometries of interconnects, FIB based circuit edit has not been practical on the package. Plasma FIB (PFIB) technology allows cuts and rewiring in the package substrate to create fully testable prototypes.
Keywords :
integrated circuit packaging; FIB based circuit edit; RF circuits; functional prototypes; package modification; package substrate; packaging technology; plasma FIB technology; Copper; Integrated circuit interconnections; Plasmas; Prototypes; Substrates;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-0980-6
DOI :
10.1109/IPFA.2012.6306324
