Title :
Advanced SEM/SPM microscopy
Author :
Heiderhoff, Ralf
Author_Institution :
Fac. of Electr., Inf. & Media Eng., Univ. of Wuppertal, Wuppertal, Germany
Abstract :
Advanced SEM/SPM microscopy will expand the application fields in failure analysis and reliability investigation, because the recognition of defects and their subsequent characterization have to be carried out with highest spatial resolution to ensure that even smallest structures with modified material properties can be evaluated. Promising for future applications is the fact that the used probes simultaneously can either be used as sensors, giving access to a vast variety of material properties, or as actuators, which can deliberately modify samples properties.
Keywords :
failure analysis; scanning electron microscopy; scanning probe microscopy; semiconductor device reliability; advanced SEM/SPM microscopy; failure analysis; reliability investigation; Electron beams; Heating; Probes; Scanning electron microscopy; Thermal analysis; Thermal conductivity;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-0980-6
DOI :
10.1109/IPFA.2012.6306335