Title :
Multi-reflection algorithm for timed statistical coupled noise checking
Author :
Smith, Howard H. ; Katopis, George ; Hsu, Mark
Author_Institution :
IBM Corp., Poughkeepsie, NY, USA
Abstract :
An algorithm has been formulated to predict the composite coupled noise signature at the receiver input for impedance mismatches associated with the package/chip interface. The formulation results in an efficient vectorized format for the reflected waves such that execution time is reduced while noise prediction approaches circuit simulation accuracy. A test case is presented to show the improvement in accuracy by accounting for reflections, when compared to circuit simulation as a benchmark. A brief discussion of execution time is also included
Keywords :
circuit analysis computing; integrated circuit design; integrated circuit noise; integrated circuit packaging; statistical analysis; circuit simulation accuracy; composite coupled noise signature; execution time; impedance mismatches; multi-reflection algorithm; noise prediction; package/chip interface; receiver input; reflected waves; timed statistical coupled noise checking; vectorized format; Acoustic reflection; Active noise reduction; CMOS technology; Circuit noise; Circuit testing; Coupling circuits; Network topology; Noise figure; Noise level; Packaging;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524677