Title :
Verification structures for transmission line pulse measurements
Author_Institution :
Agere Syst., Orlando, FL, USA
Abstract :
Test structures intended for performance verification of transmission line pulse (TLP) systems have been designed and tested. They consist of simple resistors in either copper or silicide clad polysilicon. The copper structures proved unsuitable due to excess heating and melting of any reasonable geometry. The silicide clad polysilicon proved more successful. A simple model of resistive heating accounts for observed non-linearity in the structures under high current stress.
Keywords :
pulse measurement; resistors; transmission lines; Cu; copper resistor; resistive heating; silicide clad polysilicon resistor; test structure; transmission line pulse measurement; verification structure; Breakdown voltage; Circuits; Electrical resistance measurement; Electrostatic discharge; Impedance; Pulse measurements; Resistors; Semiconductor device measurement; System testing; Transmission line measurements;
Conference_Titel :
Microelectronic Test Structures, 2002. ICMTS 2002. Proceedings of the 2002 International Conference on
Print_ISBN :
0-7803-7464-9
DOI :
10.1109/ICMTS.2002.1193191
