• DocumentCode
    3374874
  • Title

    Prediction of compression bound and optimization of compression architecture for linear decompression-based schemes

  • Author

    Li, Jia ; Huang, Yu ; Xiang, Dong

  • Author_Institution
    Sch. of Software, Tsinghua Univ., Beijing, China
  • fYear
    2011
  • fDate
    1-5 May 2011
  • Firstpage
    297
  • Lastpage
    302
  • Abstract
    On-chip linear decompression-based schemes have been widely adopted by industrial circuits nowadays to effectively reduce the ever increasing test data volume and test time. Though they can easily achieve relatively high compression ratio, there is a bound of effective compression ratio for these compression schemes. Prior work tried to address this problem by trying different compression architectures to identify this compression bound. However, they can not predict this compression bound efficiently. In this paper, we will first analyze the correlation between the effective compression ratio and the compression architecture, thus to predict that compression bound efficiently. In addition, this paper will also propose how to design the compression architecture for target effective compression ratio with one-pass calculation, which was usually done by a time-consuming try-and-error process as well in the current DFT flow. Experimental results show the accuracy of the prediction and the effectiveness of the compression architecture design.
  • Keywords
    circuit optimisation; design for testability; integrated circuit design; integrated circuit testing; DFT flow; compression architecture design; compression bound; compression ratio; on-chip linear decompression-based schemes; one-pass calculation; optimization; time-consuming try-and-error process; Accuracy; Circuit faults; Computer architecture; Correlation; Input variables; Matrix converters; System-on-a-chip; compression bound prediction; linear decompression-based; test compression; test compression optimization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Test Symposium (VTS), 2011 IEEE 29th
  • Conference_Location
    Dana Point, CA
  • ISSN
    1093-0167
  • Print_ISBN
    978-1-61284-657-6
  • Type

    conf

  • DOI
    10.1109/VTS.2011.5783737
  • Filename
    5783737