Title :
Invited paper: Yin and Yang of embedded sensors for post-scaling-era
Author_Institution :
IBM Res. Austin, Austin, TX, USA
Abstract :
As gains in integrated circuit power and performance achieved through scaling of feature sizes slows, system and circuit design must carry more of the burden for improvement. Aggressive design decreases guardbands, increasing the risk of circuit failure. This paper discusses the increasing need for embedded on-chip sensors to enable aggressive design and also to help counter the attendant increased risks.
Keywords :
failure analysis; integrated circuit reliability; microprocessor chips; sensors; attendant increased risks; circuit failure; embedded on-chip sensors; embedded sensors; integrated circuit performance; integrated circuit power; Gold; Manufacturing; Microprocessors; Monitoring; Semiconductor device measurement; System-on-a-chip; Timing;
Conference_Titel :
VLSI Test Symposium (VTS), 2011 IEEE 29th
Conference_Location :
Dana Point, CA
Print_ISBN :
978-1-61284-657-6
DOI :
10.1109/VTS.2011.5783743
