DocumentCode :
3375034
Title :
Special session: Hot topic design and test of 3D and emerging memories
Author :
Wu, Cheng-Wen
Author_Institution :
ITRI, Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear :
2011
fDate :
1-5 May 2011
Firstpage :
328
Lastpage :
328
Abstract :
In this hot topic session, we are including three talks that cover design of reliable, emerging memories, with emphasis on 3D memories, DRAM and non-volatile memories. We will also introduce a new class of memory, the Storage Class Memory (SCM), and discuss its reliability issues.
Keywords :
integrated circuit design; integrated circuit reliability; integrated circuit testing; random-access storage; 3D memories; DRAM; emerging memories; hot topic design; hot topic session; nonvolatile memories; reliable memories; storage class memory; Heating; Performance evaluation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Test Symposium (VTS), 2011 IEEE 29th
Conference_Location :
Dana Point, CA
ISSN :
1093-0167
Print_ISBN :
978-1-61284-657-6
Type :
conf
DOI :
10.1109/VTS.2011.5783744
Filename :
5783744
Link To Document :
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