DocumentCode
3375034
Title
Special session: Hot topic design and test of 3D and emerging memories
Author
Wu, Cheng-Wen
Author_Institution
ITRI, Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear
2011
fDate
1-5 May 2011
Firstpage
328
Lastpage
328
Abstract
In this hot topic session, we are including three talks that cover design of reliable, emerging memories, with emphasis on 3D memories, DRAM and non-volatile memories. We will also introduce a new class of memory, the Storage Class Memory (SCM), and discuss its reliability issues.
Keywords
integrated circuit design; integrated circuit reliability; integrated circuit testing; random-access storage; 3D memories; DRAM; emerging memories; hot topic design; hot topic session; nonvolatile memories; reliable memories; storage class memory; Heating; Performance evaluation;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium (VTS), 2011 IEEE 29th
Conference_Location
Dana Point, CA
ISSN
1093-0167
Print_ISBN
978-1-61284-657-6
Type
conf
DOI
10.1109/VTS.2011.5783744
Filename
5783744
Link To Document