Title :
Poly-silicon logic for integration of drive, sense and protection functions in discrete power devices
Author :
Wondrak, W. ; Constapel, R. ; Traute, R. ; Bokeloh, Ch ; Herzer, R.
Author_Institution :
Daimler-Benz AG, Frankfurt, Germany
Abstract :
Polysilicon is usually used as a gate material for MOS-gated power devices and can also be used for the fabrication of active components. These components can be integrated on the surface of semiconductor devices, which are dielectrically insulated by a thermal field oxide. This paper describes the application of this technology to a test field of various active and passive devices as well as analog and 15 V elementary logic circuits. It is possible to fabricate analog and digital circuits by including these results in the design process. This therefore provides an inexpensive and easy way to add diagnostic, monitoring and protection functions to power devices, especially high voltage MOSFETs and IGBTs
Keywords :
elemental semiconductors; insulated gate bipolar transistors; integrated circuit testing; integrated logic circuits; monitoring; power MOSFET; power bipolar transistors; protection; semiconductor device testing; silicon; 15 V; MOS-gated power devices; Si; active components; active devices; analog circuits; device test field; diagnostic functions; dielectric insulation; digital circuits; discrete power devices; drive/sense/protection function integration; elementary logic circuits; high voltage IGBTs; high voltage MOSFETs; monitoring protection function; passive devices; polysilicon gate material; polysilicon logic; power devices; protection function; semiconductor device surface component integration; thermal field oxide; Circuit testing; Dielectric devices; Dielectric materials; Dielectrics and electrical insulation; Fabrication; Integrated circuit technology; Logic devices; Protection; Semiconductor devices; Semiconductor materials;
Conference_Titel :
Power Semiconductor Devices and ICs, 1998. ISPSD 98. Proceedings of the 10th International Symposium on
Conference_Location :
Kyoto
Print_ISBN :
0-7803-4752-8
DOI :
10.1109/ISPSD.1998.702719