DocumentCode
3375421
Title
Special session 4A: New topics parametric yield and reliability of 3D integrated circuits: New challenges and solutions
Author
Garg, Siddharth ; Marculescu, Diana
Author_Institution
Univ. of Waterloo, Waterloo, ON, Canada
fYear
2011
fDate
1-5 May 2011
Firstpage
99
Lastpage
99
Abstract
3D integration is a promising new technology that offers numerous potential benefits including reduced wire length, high tier-to-tier bandwidth and low latency, and the possibility for heterogeneous integration of disparate technologies. As a result, 3D integrated circuits (IC) are being aggressively investigated as a potential replacement for conventional planar ICs in both academia and industry.
Keywords
integrated circuit reliability; integrated circuit yield; three-dimensional integrated circuits; 3D integrated circuits; academia; disparate technologies; industry; integrated circuit reliability; integrated circuit yield; Assembly; Clocks; Conferences; Current measurement; Design automation; Integrated circuits; Three dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium (VTS), 2011 IEEE 29th
Conference_Location
Dana Point, CA
ISSN
1093-0167
Print_ISBN
978-1-61284-657-6
Type
conf
DOI
10.1109/VTS.2011.5783764
Filename
5783764
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