Title :
Special session 4A: New topics parametric yield and reliability of 3D integrated circuits: New challenges and solutions
Author :
Garg, Siddharth ; Marculescu, Diana
Author_Institution :
Univ. of Waterloo, Waterloo, ON, Canada
Abstract :
3D integration is a promising new technology that offers numerous potential benefits including reduced wire length, high tier-to-tier bandwidth and low latency, and the possibility for heterogeneous integration of disparate technologies. As a result, 3D integrated circuits (IC) are being aggressively investigated as a potential replacement for conventional planar ICs in both academia and industry.
Keywords :
integrated circuit reliability; integrated circuit yield; three-dimensional integrated circuits; 3D integrated circuits; academia; disparate technologies; industry; integrated circuit reliability; integrated circuit yield; Assembly; Clocks; Conferences; Current measurement; Design automation; Integrated circuits; Three dimensional displays;
Conference_Titel :
VLSI Test Symposium (VTS), 2011 IEEE 29th
Conference_Location :
Dana Point, CA
Print_ISBN :
978-1-61284-657-6
DOI :
10.1109/VTS.2011.5783764
