• DocumentCode
    3375548
  • Title

    A Three Dimensional Thermal Sensor Based on Single-Walled Carbon Nanotubes

  • Author

    Selvarasah, S. ; Chen, C.-L. ; Chao, S.H. ; Makaram, P. ; Busnaina, A. ; Dokmeci, M.R.

  • Author_Institution
    Northeastern Univ., Boston
  • fYear
    2007
  • fDate
    10-14 June 2007
  • Firstpage
    1023
  • Lastpage
    1026
  • Abstract
    We present a novel three-dimensional thermal sensor based on Single-Walled Carbon Nanotubes (SWNTs) utilizing dielectrophoretic (DEP) assembly. The sensor is fabricated using a hybrid assembly technique combining top down (fabrication of the microplatform) and bottom up (DEP assembly) approaches. Encapsulating the structure with a thin (1mum) parylene layer protects it from the environment and also improves the contact resistance. Both single and multi finger assembly electrode structures have been utilized to manufacture the 3D thermal sensor and its thermal sensitivity is measured with a heated chuck. The resistances of the structures decrease more than 10% across a temperature range from 25degC to 65degC. The temperature coefficient of resistance for the SWNT-based thermal sensor is measured and ranged from -0.154 to -0.24% for the single electrode device and varied from -0.3 to - 0.57% for the multielectrode device.
  • Keywords
    carbon nanotubes; contact resistance; electrochemical electrodes; electrophoresis; nanotechnology; nanotube devices; temperature measurement; temperature sensors; 3D thermal sensor manufacturing; DEP assembly; SWNT-based thermal sensor; contact resistance; dielectrophoretic assembly technique; hybrid assembly technique; multi finger assembly electrode structures; parylene layer; single finger assembly electrode; single-walled carbon nanotubes; temperature 25 degC to 65 degC; temperature coefficients; thermal sensitivity measurement; three dimensional thermal sensor fabrication; Assembly; Carbon nanotubes; Dielectrophoresis; Electrical resistance measurement; Electrodes; Fabrication; Temperature distribution; Temperature sensors; Thermal resistance; Thermal sensors; Dielectrophoretic Assembly; Nanoscale integration; Single-Walled Carbon Nanotubes; Thermal sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
  • Conference_Location
    Lyon
  • Print_ISBN
    1-4244-0842-3
  • Electronic_ISBN
    1-4244-0842-3
  • Type

    conf

  • DOI
    10.1109/SENSOR.2007.4300307
  • Filename
    4300307