DocumentCode
3375548
Title
A Three Dimensional Thermal Sensor Based on Single-Walled Carbon Nanotubes
Author
Selvarasah, S. ; Chen, C.-L. ; Chao, S.H. ; Makaram, P. ; Busnaina, A. ; Dokmeci, M.R.
Author_Institution
Northeastern Univ., Boston
fYear
2007
fDate
10-14 June 2007
Firstpage
1023
Lastpage
1026
Abstract
We present a novel three-dimensional thermal sensor based on Single-Walled Carbon Nanotubes (SWNTs) utilizing dielectrophoretic (DEP) assembly. The sensor is fabricated using a hybrid assembly technique combining top down (fabrication of the microplatform) and bottom up (DEP assembly) approaches. Encapsulating the structure with a thin (1mum) parylene layer protects it from the environment and also improves the contact resistance. Both single and multi finger assembly electrode structures have been utilized to manufacture the 3D thermal sensor and its thermal sensitivity is measured with a heated chuck. The resistances of the structures decrease more than 10% across a temperature range from 25degC to 65degC. The temperature coefficient of resistance for the SWNT-based thermal sensor is measured and ranged from -0.154 to -0.24% for the single electrode device and varied from -0.3 to - 0.57% for the multielectrode device.
Keywords
carbon nanotubes; contact resistance; electrochemical electrodes; electrophoresis; nanotechnology; nanotube devices; temperature measurement; temperature sensors; 3D thermal sensor manufacturing; DEP assembly; SWNT-based thermal sensor; contact resistance; dielectrophoretic assembly technique; hybrid assembly technique; multi finger assembly electrode structures; parylene layer; single finger assembly electrode; single-walled carbon nanotubes; temperature 25 degC to 65 degC; temperature coefficients; thermal sensitivity measurement; three dimensional thermal sensor fabrication; Assembly; Carbon nanotubes; Dielectrophoresis; Electrical resistance measurement; Electrodes; Fabrication; Temperature distribution; Temperature sensors; Thermal resistance; Thermal sensors; Dielectrophoretic Assembly; Nanoscale integration; Single-Walled Carbon Nanotubes; Thermal sensor;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location
Lyon
Print_ISBN
1-4244-0842-3
Electronic_ISBN
1-4244-0842-3
Type
conf
DOI
10.1109/SENSOR.2007.4300307
Filename
4300307
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