• DocumentCode
    3376005
  • Title

    Busbarless emitter wrap-through solar cells and modules

  • Author

    Hacke, Peter ; Murphy, Brian ; Meakin, David ; Dominguez, Jason ; Jaramillo, Johnny ; Yamasaki, Michael ; Gee, James

  • Author_Institution
    Advent Solar, Inc., Albuquerque, NM, United States
  • fYear
    2008
  • fDate
    11-16 May 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Back-contact crystalline-silicon photovoltaic solar cells and modules offer a number of advantages including the elimination of grid shadowing losses, reduced cost by use of thinner silicon substrates, simpler module assembly, and improved aesthetics. While the existing method for interconnecting and stringing edge-connected back contact cells is acceptably straight-forward and reliable, there are further gains to be exploited when you have both contact polarities on one side of the cell. In this work, we produce ‘busbarless’ emitter wrap-through (EWT) solar cells that use about 65% less gridline Ag metallization mass compared to the edge tab design. Further, series resistance power losses are reduced by extraction of current from more places on the cell rear leading to a fill factor improvement of about 6% (relative) on the module level. Series resistance and current-generation losses associated with large rear bondpads and bus bars are eliminated. Use of thin Si wafers is enabled because of the reduced Ag metallization mass and by interconnection with conductive adhesives leading to reduced bow. The busbarless cell design interconnected with conductive adhesives passes International Electrotechnical Commission damp heat and thermal cycling tests.
  • Keywords
    Assembly; Conductive adhesives; Costs; Crystallization; Metallization; Photovoltaic cells; Photovoltaic systems; Shadow mapping; Silicon; Solar power generation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2008. PVSC '08. 33rd IEEE
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-1640-0
  • Electronic_ISBN
    0160-8371
  • Type

    conf

  • DOI
    10.1109/PVSC.2008.4922442
  • Filename
    4922442