Title :
Computation of switching noise in PCBs for digital packages
Author :
Yook, Jong-Gwan ; Chandramouli, V. ; Katehi, Linda P. ; Sakallah, Karem A.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Abstract :
Simultaneous switching noise in printed circuit boards for digital packages is computed using a hybrid technique which combines electromagnetic analysis (3D FEM) and circuit simulation (HSPICE) for fast and efficient time and frequency domain analysis
Keywords :
SPICE; circuit analysis computing; circuit noise; finite element analysis; frequency-domain analysis; packaging; printed circuit design; time-domain analysis; 3D FEM; HSPICE; PCBs; circuit simulation; digital packages; electromagnetic analysis; frequency domain analysis; printed circuit boards; switching noise; time domain analysis; Circuit analysis computing; Circuit noise; Circuit simulation; Computational modeling; Distributed computing; Equivalent circuits; Laboratories; Packaging; Printed circuits; Transmission line theory;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524688
