Title :
The simulation of cluster tools: a new semiconductor manufacturing technology
Author :
LeBaron, Todd H. ; Pool, Mark
Author_Institution :
AutoSimulations Inc., Bountiful, UT, USA
Abstract :
Semiconductor manufacturers can improve product yields and decrease chip geometry by using cluster tools to improve their process manufacturing environment. A cluster tool consists of wafer processing chambers, one or more internal robots to transport wafers, and one or more load locks where the wafer-to-cassette exchange takes place. This paper presents a flexible, cluster tool simulation model built using a general purpose simulation language. This data-driven model serves as a template which can be easily configured to emulate actual cluster tool configurations, providing statistical and graphical output. Wafer process routings are also defined through easy-to-use data input tables. The flexibility of this model is discussed, including robot parameters, tool configuration options, chamber options, and wafer processing steps. The advantages of this flexible, cluster tool simulation model as both an analysis tool and as a marketing tool are presented.
Keywords :
computer integrated manufacturing; digital simulation; industrial robots; semiconductor device manufacture; simulation languages; chamber options; chip geometry; cluster tool configurations; cluster tool simulation; cluster tool simulation model; data input tables; data-driven model; general purpose simulation language; graphical output; internal robots; load locks; marketing tool; process manufacturing environment; robot parameters; semiconductor manufacturing technology; statistical output; tool configuration; wafer process routings; wafer processing chambers; wafer processing steps; wafer-to-cassette exchange; Application software; Atmosphere; Manufacturing processes; Predictive models; Robots; Routing; Semiconductor device manufacture; Semiconductor device modeling; Throughput; Virtual manufacturing;
Conference_Titel :
Simulation Conference Proceedings, 1994. Winter
Print_ISBN :
0-7803-2109-X
DOI :
10.1109/WSC.1994.717467