• DocumentCode
    3376486
  • Title

    Effects of Cu diffusion from ZnTe:Cu/Ti contacts on carrier lifetime of CdS/CdTe thin film solar cells

  • Author

    Gessert, T.A. ; Metzger, W.K. ; Asher, S.E. ; Young, M.R. ; Johnston, S. ; Dhere, R.G. ; Moriarty, T. ; Duda, A.

  • Author_Institution
    National Renewable Energy Laboratory (NREL), Golden, CO 80401, USA
  • fYear
    2008
  • fDate
    11-16 May 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    We study the performance of CdS/CdTe thin film PV devices processed with a ZnTe:Cu/Ti contact to investigate how carrier lifetime (τ) in the CdTe layer is affected by Cu diffusion from the contact. Time-resolved photoluminescence (TRPL) measurements show that τ decreases slightly as the contacting temperature increases in the temperature regime that produces “insufficient” Cu concentration in CdTe (∼room temperature to ∼250° C). However, τ increases significantly once the contact temperature is in the range that yields “optimum” Cu concentration and high-performance devices (∼280 to ∼320°C). At higher substrate temperatures (≫∼300° C), τ drops precipitously, consistent with a region previously identified as producing “excessive” Cu concentration - and poor device performance. The observed τ increase within the “optimum temperature” range not only suggests why high-performance devices may form at these contact temperatures using many different contact processes (including paste contacts), but may provide a significant clue as to why Cu-contact formation processes impart a broad latitude in other process parameters.
  • Keywords
    Charge carrier lifetime; Costs; Etching; Fabrication; Geometry; Gold; Photovoltaic cells; Solid state circuits; Transistors; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2008. PVSC '08. 33rd IEEE
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-1640-0
  • Electronic_ISBN
    0160-8371
  • Type

    conf

  • DOI
    10.1109/PVSC.2008.4922469
  • Filename
    4922469