• DocumentCode
    3376546
  • Title

    Improved Neuronal Adhesion to the Surface of Electronic Device by Engulfment of Protruding Micro-Nails Fabricated on the Chip Surface

  • Author

    Spira, Micha E. ; Kamber, Dotan ; Dormann, Ada ; Cohen, Ariel ; Bartic, Carmen ; Borghs, Gustaf ; Langedijk, J.P.M. ; Yitzchaik, Shlomo ; Shabthai, Keren ; Shappir, Josef

  • Author_Institution
    Hebrew Univ. of Jerusalem, Jerusalem
  • fYear
    2007
  • fDate
    10-14 June 2007
  • Firstpage
    1247
  • Lastpage
    1250
  • Abstract
    One of the major problems in assembling efficient neuro-electronic hybrids systems is the low electrical coupling between the components. This is mainly due to the low resistance, extracellular cleft formed between the cell´s plasma membrane and the substrate to which it adhere. This cleft shunts the current generated by the neuron, or the device and thus reduces the signal to noise ratio. To increase the clefts electrical resistance we fabricated gold micronails that protrude from the transistor gate surface. The micronails were functionalized by phagocytosis facilitating peptides. Cultured neurons readily engulf the functionalized micronails forming tight physical contact between the cells and the surface of the device.
  • Keywords
    cellular biophysics; micromechanical devices; molecular electronics; chip surface; cultured neurons; electrical coupling; electrical resistance; electronic device; functionalized micronails; gold micronails; low resistance extracellular cleft; neuro-electronic hybrids systems; neuronal adhesion; phagocytosis facilitating peptides; plasma membrane; protruding micronails; seal resistance; transistor gate surface; Adhesives; Assembly systems; Biomembranes; Couplings; Electric resistance; Extracellular; Neurons; Plasma devices; Signal generators; Surface resistance; Cultured neurons; Neuro-Electronic hybrids; Seal resistance; adhesion to substrate;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
  • Conference_Location
    Lyon
  • Print_ISBN
    1-4244-0842-3
  • Electronic_ISBN
    1-4244-0842-3
  • Type

    conf

  • DOI
    10.1109/SENSOR.2007.4300363
  • Filename
    4300363