Title :
Reliability, thermal, and power modeling and optimization
Author_Institution :
EECS Dept., Univ. of Michigan, Ann Arbor, MI, USA
Abstract :
This tutorial provides an overview of challenges to designing and implementing reliable integrated circuits and systems, and suggests areas for future study. It illustrates some concepts in detail, explaining the challenges of appropriately considering the impact of temperature on reliability in fault-tolerant systems. Finally, it points out considerations that may influence adoption of reliability modeling and optimization techniques and stresses the importance of considering the most relevant fault processes during reliability modeling and optimization.
Keywords :
fault simulation; integrated circuit modelling; integrated circuit reliability; optimisation; fault process; fault-tolerant systems; optimization techniques; power modeling; reliability modeling; reliable integrated circuits; Circuit faults; Computational modeling; Integrated circuit modeling; Optimization; Power demand; Reliability engineering;
Conference_Titel :
Computer-Aided Design (ICCAD), 2010 IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-8193-4
DOI :
10.1109/ICCAD.2010.5654140
