• DocumentCode
    3376972
  • Title

    Mathematical yield estimation for two-dimensional-redundancy memory arrays

  • Author

    Chao, Mango C T ; Chin, Ching-Yu ; Lin, Chen-Wei

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    7-11 Nov. 2010
  • Firstpage
    235
  • Lastpage
    240
  • Abstract
    Defect repair has become a necessary process to enhance the overall yield for memories since manufacturing a natural good memory is difficult in current memory technologies. This paper presents an yield-estimation scheme, which utilizes an induction-based approach to calculate the probability that all defects in a memory can be successfully repaired by a two-dimensional redundancy design. Unlike previous works, which rely on a time-consuming simulation to estimate the expected yield, our yield-estimation scheme only requires scalable mathematical computation and can achieve a high accuracy with limited time and space complexity. Also, the proposed estimation scheme can consider the impact of single defects, column defects, and row defects simultaneously. With the help of the proposed yield-estimation scheme, we can effectively identify the most profitable redundancy configuration for large memory designs within few seconds while it may take several hours or even days by using conventional simulation approach.
  • Keywords
    estimation theory; integrated circuit yield; logic arrays; probability; semiconductor storage; defect probability; defect repair; induction based approach; mathematical yield estimation; two dimensional redundancy memory arrays; Accuracy; Algorithm design and analysis; Equations; Estimation; Maintenance engineering; Mathematical model; Redundancy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design (ICCAD), 2010 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-4244-8193-4
  • Type

    conf

  • DOI
    10.1109/ICCAD.2010.5654154
  • Filename
    5654154