A comparison of air flow and shielding effectiveness of perforated enclosure panels

Author

Jackman, Tom ; Ju, Wendy ; Gisin, Franz ; Duckett, Jim ; Evans, Joseph

Author_Institution

Silicon Graphics Inc., Mountain View, CA, USA

Volume

2

fYear

1999

fDate

1999

Firstpage

583

Abstract

The goals of the thermal engineer and EMC engineer often lead to contradictory design requirements. The EMC engineer wants smaller cooling openings to provide more attenuation of electromagnetic leakage through an enclosure, while the thermal engineer wants larger openings to minimize the restriction of air flow. Previous research on perforated enclosure panels has focused mainly on their EMC performance with little thought given to how they impact the flow of cooling air. This paper addresses this deficiency by examining how the shapes and locations of the perforations also impact these two critical areas

Keywords

cooling; electromagnetic compatibility; electromagnetic shielding; laminar flow; packaging; EMC engineer; EMC performance; cooling air flow; cooling openings; design requirements; electromagnetic leakage attenuation; laminar air flow; perforated enclosure panels; perforation location; perforation shapes; shielding effectiveness; thermal engineer; Apertures; Attenuation; Clocks; Cooling; Design engineering; Electromagnetic compatibility; Graphics; Silicon; Testing; Thermal engineering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 1999 IEEE International Symposium on

Conference_Location

Seattle, WA

Print_ISBN

0-7803-5057-X

Type

conf

DOI

10.1109/ISEMC.1999.810080

Filename

810080