• DocumentCode
    3377068
  • Title

    Time and frequency domain analysis of integral decoupling capacitors

  • Author

    Goetz, Martin P.

  • Author_Institution
    Technol. Group, ASAT Inc., Palo Alto, CA, USA
  • fYear
    1995
  • fDate
    2-4 Oct 1995
  • Firstpage
    52
  • Lastpage
    54
  • Abstract
    Decoupling capacitors have been designed and included in high speed packaging systems to avoid voltage drops across the power supply caused by interconnect inductance. The effectiveness of certain types of decoupling capacitors is reviewed using both time and frequency domain modeling and measurement techniques. The results will provide insight into the effectiveness of certain types of capacitors used within a system
  • Keywords
    capacitors; frequency-domain analysis; packaging; time-domain analysis; frequency domain analysis; high speed packaging systems; integral decoupling capacitors; interconnect inductance; power supply; time domain analysis; voltage drops; Bandwidth; Capacitors; Equations; Frequency domain analysis; Frequency measurement; Impedance measurement; Integrated circuit interconnections; Packaging; Permittivity; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1995
  • Conference_Location
    Portland, OR
  • Print_ISBN
    0-7803-3034-X
  • Type

    conf

  • DOI
    10.1109/EPEP.1995.524693
  • Filename
    524693
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3377068