DocumentCode :
3377406
Title :
High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength
Author :
Tanaka, Toshikatsu ; Wang, Zengbin ; Iizuka, Tomonori ; Kozako, Masahiro ; Ohki, Yoshimichi
Author_Institution :
IPS Res. Center, Waseda Univ., Kitakyushu, Japan
fYear :
2011
fDate :
22-24 Dec. 2011
Firstpage :
1
Lastpage :
4
Abstract :
Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/ nano silica nano micro composite with thermal conductivity 12 W/m·K and BD strength 15 kVpeak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.
Keywords :
composite materials; electric breakdown; surface treatment; thermal conductivity; high breakdown strength; high thermal conductivity epoxy/BN composites; material conditions; nano filler addition; sufficient dielectric breakdown strength; surface treatment; Conductivity; Dielectric breakdown; Educational institutions; Materials; Silicon compounds; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power and Energy Systems (ICPS), 2011 International Conference on
Conference_Location :
Chennai
Print_ISBN :
INAVLID ISBN
Type :
conf
DOI :
10.1109/ICPES.2011.6156695
Filename :
6156695
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3377406
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