DocumentCode
3377419
Title
Via coupling within rectangular power-ground planes
Author
Parker, James C., Jr.
Author_Institution
Fujitsu Comput. Packaging Technol., San Jose, CA, USA
fYear
1995
fDate
2-4 Oct 1995
Firstpage
61
Lastpage
63
Abstract
Convenient formulas are presented for both frequency-domain mutual impedance, and time-domain voltage waveforms. These expressions are valid for arbitrary via locations, and take into account all edge reflections. Skin effect is included within the frequency domain formulas
Keywords
frequency-domain analysis; packaging; skin effect; time-domain analysis; transmission lines; edge reflections; frequency-domain mutual impedance; packaging; rectangular power-ground planes; skin effect; time-domain voltage waveforms; via coupling; Capacitance; Conductivity; Dielectric losses; Frequency domain analysis; Impedance; Packaging; Power transmission lines; Skin effect; Transmission line matrix methods; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1995
Conference_Location
Portland, OR
Print_ISBN
0-7803-3034-X
Type
conf
DOI
10.1109/EPEP.1995.524695
Filename
524695
Link To Document