Title :
Via coupling within rectangular power-ground planes
Author :
Parker, James C., Jr.
Author_Institution :
Fujitsu Comput. Packaging Technol., San Jose, CA, USA
Abstract :
Convenient formulas are presented for both frequency-domain mutual impedance, and time-domain voltage waveforms. These expressions are valid for arbitrary via locations, and take into account all edge reflections. Skin effect is included within the frequency domain formulas
Keywords :
frequency-domain analysis; packaging; skin effect; time-domain analysis; transmission lines; edge reflections; frequency-domain mutual impedance; packaging; rectangular power-ground planes; skin effect; time-domain voltage waveforms; via coupling; Capacitance; Conductivity; Dielectric losses; Frequency domain analysis; Impedance; Packaging; Power transmission lines; Skin effect; Transmission line matrix methods; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524695
