Title :
Coupled IE-PO method for analysis of antenna radiation patterns in the presence of a large 3D radome
Author :
Zhao, Wei-Jiang ; Gan, Yeow-Beng ; Wang, Chao-Fu ; Le-Wei Li
Author_Institution :
Temasek Labs., Nat. Univ. of Singapore, Singapore
Abstract :
A method based on integral equation (IE) coupled with physical optics (PO) method is proposed for the analysis of antennas in the presence of a large three-dimensional (3D) dielectric radome. The electric field integral equation (EFIE) is applied to the conducting surfaces of the antenna array enclosed within a large 3D radome. Equivalent PO surface currents aree assumed on the radome walls induced by the near field radiation of the antenna. The PO currents are coupled back into the integral equation to account for the effects of the radome on the antenna. The resultant current distribution on the antenna obtained by this coupled IE-PO method is useful for computation of the antenna´s input impedance and radiation patterns with the effect of radome. As the PO method is applied to the large radome, no additional unknowns are needed, besides those defined on the surface of the antenna, leading to a substantial reduction in computational resources required. Numerical simulation showing the accuracy and efficiency of the coupled IE-PO method is presented.
Keywords :
antenna arrays; antenna radiation patterns; current distribution; electric field integral equations; electric impedance; numerical analysis; physical optics; radomes; EFIE; antenna array; antenna radiation patterns; coupled IE-PO method; current distribution; electric field integral equation; equivalent surface currents; input impedance; large 3D radome; near field radiation; numerical simulation; physical optics; three-dimensional dielectric radome; Antenna arrays; Antenna radiation patterns; Current distribution; Dielectrics; Distributed computing; Integral equations; Near-field radiation pattern; Optical coupling; Pattern analysis; Physical optics;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2004. IEEE
Print_ISBN :
0-7803-8302-8
DOI :
10.1109/APS.2004.1329765