EMI associated with inter-board connection for module-on-backplane and stacked-card configurations

Author

Ye, X. ; Nadolny, J. ; Drewniak, J.L. ; Hubing, T.H. ; Vaudoren, T.P. ; DuBroff, D.E.

Author_Institution

Dept. of Electr. & Comput. Eng., Missouri Univ., Rolla, MO, USA

Volume

2

fYear

1999

fDate

1999

Firstpage

797

Abstract

EMI associated with inter-board connection was studied through common-mode current measurements and FDTD modeling for stacked-card and module-on-backplane configurations. Three types of connections were investigated experimentally including an open pin field connection, an “ideal” semi-rigid coaxial cable connection, and a production connector. Both microstrip and stripline signal routing on the PCB were investigated. The results indicated signal routing on the PCBs or the inter-board connection can dominate the EMI process. Several cases of connector geometries were studied using FDTD modeling and good agreement was achieved between the measured and FDTD results

Keywords

coaxial cables; electric connectors; finite difference time-domain analysis; microstrip lines; printed circuit accessories; printed circuit layout; radiofrequency interference; EMI associated; FDTD modeling; PCB; common-mode current measurements; connector geometries; inter-board connection; microstrip signal routing; module-on-backplane configuration; open pin field connection; production connector; semi-rigid coaxial cable connection; stacked-card configuration; stripline signal routing; Coaxial cables; Connectors; Current measurement; Electromagnetic interference; Finite difference methods; Microstrip; Production; Routing; Stripline; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 1999 IEEE International Symposium on

Conference_Location

Seattle, WA

Print_ISBN

0-7803-5057-X

Type

conf

DOI

10.1109/ISEMC.1999.810121

Filename

810121