DocumentCode :
3378078
Title :
Temperature sensor placement in thermal management systems for MPSoCs
Author :
Zanini, Francesco ; Atienza, David ; Jones, Colin N. ; De Micheli, Giovanni
Author_Institution :
Lab. of Integrated Syst. (LSI), EPFL, Lausanne, Switzerland
fYear :
2010
fDate :
May 30 2010-June 2 2010
Firstpage :
1065
Lastpage :
1068
Abstract :
Modern high-performance processors employ thermal management systems, which rely on accurate readings of on-die thermal sensors. Systematic tools for analysis and determination of best allocation and placement of thermal sensors is therefore a highly relevant problem. This paper proposes a novel technique for determining the placement of temperature sensors on complex Multi-Processor Systems-on-Chips (MPSoCs) floorplans. The proposed method first analyzes the observability of the system for all the possible sensor placement configurations. Minimum sensors placements ensuring the observability of the portion of the MPSoC system that is relevant to the designer are then compared with simulation-based data coming from a wide set of benchmarks. Pareto points identifying the best configurations are than stored. According to user designer needs the best configuration is selected and a specific location is assigned to each sensor. We compared the proposed method with state-of-the-art approaches. Results show a reduction up to 4.5× in the number of required sensors.
Keywords :
multiprocessing systems; sensor placement; system-on-chip; temperature sensors; thermal analysis; thermal management (packaging); MPSoC system; Pareto points; high-performance processors; multiprocessor system-on-chips; on-die thermal sensors; simulation-based data; temperature sensor placement; thermal management systems; thermal sensor allocation; Frequency; Laboratories; Observability; Power system modeling; Sensor systems; Silicon; Sun; Temperature sensors; Thermal management; Thermal sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
Conference_Location :
Paris
Print_ISBN :
978-1-4244-5308-5
Electronic_ISBN :
978-1-4244-5309-2
Type :
conf
DOI :
10.1109/ISCAS.2010.5537347
Filename :
5537347
Link To Document :
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